Bullet_point: ['Epoxy Assembly process provides card with a waterproof housing for extra protection', 'New Chip on Board / COM Technology shrinks internal components of card to provide more room for a more reinforced, durable structure', 'New Sony Firmware upgrade for XDCAM', 'Steel-plated, highly durable card', 'Unlimited XDCAM overcranking at all available speeds, thanks to 3 new upgrades'] (Page 1)